Our Facilities

We are a vertically integrated company that manufacture electronic sub assemblies and complete products. Our in-house through-hole and surface mount component PCB manufacturing equipment includes stencil printers, pick and place machinery, SMT reflow ovens, ultrasonic board cleaners and SMT workstations. We are fully equipped for the inspection (stereoscopic microscopes) and testing (oscilloscopes, signal generators, board programmers, etc.) of assembled electronics. We also have equipment for developing and testing wireless products (spectrum analyzers, RF signal generators, etc.)

We manufacture a wide array of mechanical components and sub-assemblies. Our in-house mechanical manufacturing abilities include 4-Axis Computer Numerical Controlled (CNC) Milling, Large Format 3-Axis CNC Routing, 3D Computer Aided Manufacturing (CAM) and Fused Deposition Modeling (FDM). We realize that conventional production setup costs for bringing a product to market can be prohibitive and utilize Low Volume Silicone Mold Casting processes to produce parts without large non-recurring expenses (NRE). We also encase and pot electronic assemblies and convert adhesive and gasketing on our Clicker Die Press.